available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 544 - 2414 +44 2392 - 2323 92 model jp50 3as rev a hybrid couplers 3 db, 90 ? description the jp503 as is a low profile, high performance 3db hybrid coupler in a n easy to use, manufacturing friendly surface mount package. it is designed for w - cdma and other 3g applications. the jp503 as is d esigned for balanced amplifiers, variable phase shifters and attenuators, lnas, signal distribution and is an ideal solution for the ever - increasing demands of the wireless industry for smaller printed circuit boards and high performance. parts have been subjected to rigorous qualification testing and t hey are manufactured using materials with coefficients of thermal expansion (cte) compatible with common substrates such as fr4, g - 10, rf - 35, ro4003 and polyimide. produced with 6 of 6 rohs compliant tin im mersion finish. electrical specifications** features: ? 2.0 C 2.3 ghz. ? 3g frequencies ? low loss ? high isolation ? 90 quadrature ? surface mountable ? tape and reel ? lead free ? 100% tested frequency isolation insertion loss vswr ghz db min db max max:1 2.0 C 2. 3 20 0.30 1.20 amplitude balance phase balance power ? jc operating temp. db max degrees ave. cw watts o c/watt o c 0.25 3 25 27.5 - 55 to +85 **specification based on performance of unit properly installed on microstrip printed circuit boar ds with 50 ? nominal impedance. specifications subject to change without notice. outline drawing part is symmetric about all axis tolerances are non - cumulative dimensions are in inches [millimeters] j p503 a s mechanical outline
usa/canada: toll free: europe: (315) 432 - 8909 (800) 544 - 2414 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model jp503 as rev. a hybrid coupler pin configuration the JP503AS has an orientation marker to denote pin 1. once port one has been identified the other ports are known automatically. please see the chart below for clarification: configuration pin 1 pin 2 pin 3 pin 4 splitter input isolated - 3db 90 ? ? ? - 3db ? ? splitter isolated input - 3db ? ? - 3db 90 ? ? ? splitter - 3db 90 ? ? ? - 3db ? ? input isolated splitter - 3db ? ? - 3db 90 ? ? ? isolated i nput *combiner a 90 ? ? ? a ? ? isolated output *combiner a ? ? a 90 ? ? ? output isolated *combiner isolated output a 90 ? ? ? a ? ? *combiner output isolated a ? ? a 90 ? ? ? *notes: a is the amplitude of the applied signals. when two quadrature signals with equal amplitudes are appl ied to the coupler as described in the table, they will combine at the output port. if the amplitudes are not equal, some of the applied energy will be directed to the isolated port. the actual phase, ? ? , or amplitude at a given frequency for all ports, can be seen in our de - embedded s - parameters, that can be downloaded at www.anaren.com .
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 544 - 2414 +44 2392 - 2323 92 model jp50 3as rev a typical performance ( - 5 5 c, 25c & 125 c): 2000 - 2300 mhz
usa/canada: toll free: europe: (315) 432 - 8909 (800) 544 - 2414 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model jp503 as rev. a typical performance ( - 5 5 c, 25c & 125 c): 2000 - 2300 mhz
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 544 - 2414 +44 2392 - 2323 92 model jp50 3as rev a definition of measured specifications parameter definition mathematical representation vswr (voltage standing wave ratio) the impedance match of the coupler to a 50 ? system. a vswr of 1:1 is optimal. vswr = min max v v vmax = voltage maxima of a standing wave vmin = vo ltage minima of a standing wave return loss the impedance match of the coupler to a 50 ? system. return loss is an alternate means to express vswr. return loss (db)= 20log 1 - vswr 1 vswr ? insertion loss the input power divided by the sum of the power at the two outp ut ports. insertion loss(db)= 10log direct cpl in p p p ? isolation the input power divided by the power at the isolated port. isolation(db)= 10log iso in p p phase balance the difference in phase angle between the two output ports. phase at coupled port C phase at direct port ampl itude balance the power at each output divided by the average power of the two outputs. 10log ? ? ? ? ? ? ? 2 p p p direct cpl cpl and 10log ? ? ? ? ? ? ? 2 p p p direct cpl direct
usa/canada: toll free: europe: (315) 432 - 8909 (800) 544 - 2414 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model jp503 as rev. a JP503AS power derating curve power derating: the power handling and corresponding p ower derating plots are a function of the thermal resistance, mounting surface temperature (base plate temperature), maximum continuous operating temperature of the coupler, and the thermal insertion loss. the thermal insertion loss is defined in the powe r handling section of the data sheet. as the mounting interface temperature approaches the maximum continuous operating temperature, the power handling decreases to zero.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 544 - 2414 +44 2392 - 2323 92 model jp50 3as rev a mounting in order for xinger surface mount couplers to work optimally, there must be 50 ? transmission lines leading to and from all of the rf ports. also, there must be a very good ground plane underneath the part to ensure proper electrical performance. if either of these two conditions is not satisfied, electrical perfor mance may not meet published specifications. overall ground is improved if a dense population of plated through holes connect the top and bottom ground layers of the pcb. this minimizes ground inductance and improves ground continuity. all of the xinger hybrid and directional couplers are constructed from ceramic filled ptfe composites which possess excellent electrical and mechanical stability having x and y thermal coefficient of expansion (cte) of 17 - 25 ppm/ o c. when a surface mount hybrid coupler is m ounted to a printed circuit board, the primary concerns are; ensuring the rf pads of the device are in contact with the circuit trace of the pcb and insuring the ground plane of neither the component nor the pcb is in contact with the rf signal. mounting footprint coupler mounting process the process for assembling this component is a conventional surface mount process as shown in figure 1. this process is conducive to both low and high volume usage. figure 1: surface mou nting process steps storage of components: xinger products are available in either an immersion tin or tin - lead finish. commonly used storage procedures used to control oxidation should be followed for these surface mount components. the storage temperat ures should be held between 15 o c and 60 o c. substrate: depending upon the particular component, the circuit material has an x and y coefficient of thermal expansion of between 17 and 25 ppm/c. this coefficient minimizes solder joint stresses due to simila r expansion rates of most commonly used board substrates such as rf35, ro4003, fr4, polyimide and g - 10 materials. mounting to hard substrates (alumina etc.) is possible depending upon operational temperature requirements. the solder surfaces of the coupl er are all copper plated with either an immersion tin or tin - lead exterior finish. solder paste: all conventional solder paste formulations will work well with anarens xinger surface mount components. solder paste can be applied with stencils or syringe dispensers. an example of a stenciled solder paste deposit is shown in figure 2. as shown in the figure solder paste is applied to the four rf pads and the entire ground plane underneath the body of the part. dimensions are in inches [millimeters] .174 [4.42] .124 [3.15] 4x 50 ? transmission line to ensure proper electrical and thermal performance there must be a ground plane with 100% solder conection underneath the part 4x .045 sq [1.14] 4x .024 [0.61] 4x .099 [2.51] 4x .024 [0.61] multiple plated thru holes to ground
usa/canada: toll free: europe: (315) 432 - 8909 (800) 544 - 2414 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model jp503 as rev. a figure 2: solder paste application co upler positioning: the surface mount coupler can be placed manually or with automatic pick and place mechanisms. couplers should be placed (see figure 3 and 4) onto wet paste with common surface mount techniques and parameters. pick and place systems must supply adequate vacuum to hold a 0.106 gram coupler. figure 3: component placement figure 4: mounting features example reflow: the surface mount coupler is conducive to most of todays conventional reflow methods. a low and high temperature t hermal reflow profile are shown in figures 5 and 6, respectively. manual soldering of these components can be done with conventional surface mount non - contact hot air soldering tools. board pre - heating is highly recommended for these selective hot air sold ering methods. manual soldering with conventional irons should be avoided.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 544 - 2414 +44 2392 - 2323 92 model jp50 3as rev a figure 5 C low temperature solder reflow thermal profile figure 6 C high temperature solder reflow thermal profile
usa/canada: toll free: europe: (315) 432 - 8909 (800) 544 - 2414 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model jp503 as rev. a packaging and ordering i nformation packaging follows eia - 481 - 2. parts are oriented in tape as shown below. minimum order quantities are 2000 per reel. xinger ? tape & reel diagram
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